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Tel:886-3-3858000
Fax: 886-3-3858333
DowDuPont
About DuPont Electronics & Imaging
With the 2017 merger of Dow and DuPont, Dow Electronic Materials and DuPont Electronics & Communications have combined their portfolios and expertise to create the new DuPont Electronics & Imaging business, which is part of the new Specialty Products Division of DowDuPont. DuPont Electronics & Imaging is a global supplier of materials and technologies serving the semiconductor, advanced chip packaging, circuit board, electronic and industrial finishing, phot...More
Main Products
1. IC Substrate
1-1 SAP Metallization
1-2 ELIC Via Filling
1-3 Through Hole Filling
1-4 Autocatalytic Silver
2. HDI
2-1 High Reliability Electroless Cu
2-2 Blind Via Filling
2-3 Black Oxide for Direct Laser
3. MLB
3-1 High Aspect Ratio Electroless Cu
3-2 High Aspect Ratio Cu Plating
3-3 Tin Plating
3-4 Low Gold Immersion Gold
3-5 Liquid Photo Resist
4. FPC
4-1 Electroless Cu
4-2 Direct Metallization
4-3 Cu Plating
4-4 Electroless Ni iAu
4-5 Electrolytic Ni and Au
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