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- Aluminum Copper Clad Laminate
Aluminum Copper Clad Laminate
Model: LC2000L、LC4000、LC6000
Category: Materials and Chemicals for PCB / Materials for PCB / Copper Clad Laminates with Metal Core
Characteristics
Aluminum copper clad laminate is an excellent thermal conductivity materials for printed circuit board substrate. Aluminum copper clad laminate is manufactured with good dimensional stability, small heat resistance and good plasticity. It can shear , punching and other mechanical processing. It also can adapt to the usual plating process, the conduction band of the bonding process.
The aluminum base copper clad laminate is a unique metal base copper clad substrate with advanced dielectric properties, enhanced thermal conductivity, and excellent mechanical performance. The heat caused by power devices is transferred efficiently step by step. Firstly, from circuit layer to dielectric layer, then to metal base layer , then to heat sink.
Compared with traditional rigid copper clad laminate, which can be thermal resistance to a minimum, so that the substrate has excellent thermal conductivity. Compared with the ceramic circuit, its mechanical properties and processing performance are better. In addition it has other advantages:
1) More effective processing circuit design on the thermal diffusion
2) Operation can reduce the temperature of the device and module to extend the service life and increase power density and reliability;
3) Reduce the heat sink and hardware assembly（including the thermal interface material）, narrowing modules volume, and reducing hardware and assembly costs;
4) Replace fragile ceramic circuit substrate, to obtain better mechanical endurance.
Because of its light weight , anti-oxidation, cheap, and good heat dissipation aluminum copper clad laminate is widely adopted.
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