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Plasma Cleaner
Model: DPC06
Category: Machines & Equipments for PCB / PCB Wet Process Equipment / Plasma Cleaning and Surface Treatment Machine
Characteristics
Production Description
Creating Nano PC06 low pressure plasma cleaner system can be used on all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning.
Product Features
Desktop design, small footprint, does not take up much space
Equipment for schools, laboratories, medical institutes, R&D units and electronic factories
R&D costs and low equipment costs
Equipment operation is easy, actions are simple and easy to understand
Bombardments of electrodes
High density plasma source
Processing speed, clean, high efficiency, high reliability
Low ion energy can be controlled, does not damage the substrate
Combination of chemical reactivity and physical bombardments
Extremely high plasma uniformity
Equipment can remove oxides and sulfides
The best surface cleaning and treatment effects
High reliability and easy maintenance
Customization
Industry Applications
LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic components, electronic components, Packaging before the clean.
Before printing or adhesive surface roughening or cleaning.
Specs
Specifications |
DPC06 |
Footprint (W*D*H) |
650*720*625mm |
Chamber Size (W*D*H) |
300*230*300mm |
Weight |
150kg |
Facilities |
3Ø220V*60Hz*4w, 20A |
System control software |
PC base |
Vacuum pump |
Rotary |
Reactants |
Ar |
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