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Akrometrix DIC & CRE 模组 & Interface Analysis 软件
产品型号:Akrometrix DIC & CRE & Interface Analysis
产品特色
Digital Image Correlation - DIC模组
• 2 x 1.4MP 火线相机: 2 x 23mm 固定变焦镜头
• 数据采集时间少于1秒
• 在平面分辨率达: 0.5 - 1.0 μm
• In-Plane 应变分辨率: 150 microstrain (Δ L/L)
• Out-of-Plane 平面分辨率: 1.0 - 2.0 μm
• 温度范围: 26°C - 300°C
• 视线范围: 45mm x 34mm/66mm x 48mm/88mm x 66mm
CRE Module
Scheduled for release in mid 2014, the CRE (Convection Reflow Emulation) Module is an add-on module for the TherMoire AXP and Studio PS400 systems powered by the Studio Software. The CRE Module addresses the semiconductor industry requirement for maximum resolution surface measurement and effective reflow emulation with optimized top/bottom temperature uniformity, while utilizing convection heating.
The CRE Module enhances Akrometrix's industry-standard shadow moire measurement technique and offers Z displacement measurement from 2.5 microns down to sub-micron resolution. The CRE Module is the fourth add-on module for the expandable TherMoire platform.
Akrometrix Interface Analysis軟體
實時監測迴流焊過程中PCB及元器件變形情況3D圖形分析軟體
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