Micromaterial processing with Laser Technology

Electroless Nickel and Immersion Gold Series

High Current and High TP Via-filling -VFP21

Immersion Thick Gold Series

MSAP Pattern Via-filling –TFP

Supper Thin Surface Copper Via-filling -VFP28

Quick/Large Blind-via Filling -VFP08

Immersion Tin

Immersion Silver

ENIG for FPC

JHD Copper Oxide

automatic vacuum packaging machine

automatic vacuum packaging machine

Vacuum Hot Press

Image Processing System Multi-point Compensating X-RAY 2&3&4 Spindle Automatic Measuring and Drilling Machine

UV Laser system for Flex Drilling and Cutting

EIE Laser PhotoPlotter

Foam Type Buff

Jet scrubber line (Pumice)

Acura

ADIX (Direct Imaging)

IN-LINE AOI

Robot Loading System

Ceamic Buff

三菱基板鑽孔用雷射加工機

ML605GTW5

NISSIN微波電源等離子雙面處理裝置

ML605GTW4-UVF20

Mitsubishi Laser Drilling

LPKF 3D-MID LDS

LPKF Through-Glass Vias with Laser Precisions

LPKF StencilLaser

NEW LED COLD LIGHT SOURCE SEMI-AUTO EXPOSURE MACHINE

Precision Coated Router HCN Series

Horizontal / Vertical desmear process

Horizontal Electroless Copper