PCB industry information

SoftBank Teams Up with Intel to Target AI Data Centers; Next-Generation Low-Power Memory Aims for 2028 Launch

 

Source:TPCA Updated Time:2026/02/04

Email

 

SoftBank Corp. announced on Tuesday (3rd) that its subsidiary, Saimemory, has entered into a partnership with Intel to jointly develop next-generation memory chip technology featuring high capacity, high bandwidth, and low power consumption.

Saimemory and Intel have proposed a new memory operation architecture called “Z-Angle Operation Memory Technology,” and both parties will work together to commercialize this architecture in the future.

SoftBank stated that the goal of developing this technology is to penetrate AI data center applications and meet the massive computing demands required by generative AI models. Under the partnership, Saimemory will utilize Intel’s next-generation DRAM bonding technology, with a prototype product targeted for release as early as the beginning of 2028.

SoftBank Group Corp. agreed to invest USD 2 billion in Intel in mid-last year. SoftBank Corp. is a listed subsidiary under SoftBank Group and serves as the group’s primary operating entity. (Source: Anue News)

 

Share

 

Email

 

 

 

X