Total Investment of RMB 2 Billion! Shengyi Electronics Launches High-Layer AI Computing PCB Project

Source：TPCA　Updated Time：2026/07/01

Recently, the commissioning ceremony for the Ji’an Shengyi Electronics Intelligent Manufacturing High-Layer AI Computing Circuit Board Project was grandly held. Leaders from the Jinggangshan Economic Development Zone, the company’s management team, and employee representatives gathered to witness this important milestone together.

Chen Zhengqing, Deputy General Manager of Shengyi Electronics and General Manager of Ji’an Shengyi Electronics, delivered a speech introducing the project. He reviewed the various challenges overcome since the project’s groundbreaking and expressed gratitude for the support from all parties and the dedication of the project team. The official launch of the Ji’an Shengyi Electronics Intelligent Manufacturing High-Layer AI Computing Circuit Board Project represents one of the company’s core strategic initiatives to seize opportunities in the AI computing industry, expand mid- to high-end PCB production capacity, and enhance its global industrial layout. After commissioning, the project is expected to significantly strengthen the company’s competitiveness in the high-layer and AI computing PCB market segments. Moving forward, the project will continue to uphold strict quality and safety standards, rigorously implement production expansion targets, and strive to build a benchmark smart factory for high-end PCBs, injecting new momentum into the long-term development of “Century Shengyi.”

Zhang Gongjing, General Manager of Shengyi Electronics and Chairman of Ji’an Shengyi Electronics, expressed sincere appreciation to all government departments and partner organizations that supported the project’s construction. He also praised the Ji’an team for its efficient execution and problem-solving capabilities demonstrated throughout the project development process. He emphasized that the Intelligent Manufacturing High-Layer AI Computing Circuit Board Project is an important strategic initiative for the company to capture high-end markets, optimize product structure, and enhance core competitiveness. He called on the Ji’an team to continue advancing the project with high standards, high quality, and high efficiency, aiming to complete the second phase and achieve operational targets as soon as possible, while continuously meeting customer needs and creating greater value for customers.

Hu Xiangxue, Member of the Party Working Committee and Deputy Director of the Administrative Committee of the Jingkai District, expressed appreciation for Shengyi Electronics’ decision to locate the Intelligent Manufacturing High-Layer AI Computing Circuit Board Project in the district and congratulated the company on the successful launch. Since settling in Ji’an in 2018, Ji’an Shengyi Electronics has achieved revenue of RMB 1.256 billion in 2025 at “Shengyi Speed” and has been recognized as a National High-Tech Enterprise, among other honors. The newly launched project aligns with the development direction of advanced productive forces and will help support the Jingkai District’s goal of building a trillion-yuan industrial park. The district administration pledged to continue optimizing the business environment and providing strong support services, while hoping the company will use this milestone as a new starting point to become an industry benchmark, play a leading role in the sector, and jointly build a more competitive electronic information industry cluster.

Following the speeches, a launch ceremony was held, marking the official entry of the Ji’an Shengyi Electronics Intelligent Manufacturing High-Layer AI Computing Circuit Board Project into a new phase.

The Ji’an Shengyi Electronics Intelligent Manufacturing High-Layer AI Computing Circuit Board Project is one of Shengyi Electronics’ key strategic projects. Located in the Jinggangshan Economic Development Zone, the project leverages the region’s mature electronic information industry cluster and the operational foundation established in Phase I. With a total investment of approximately RMB 2 billion (including factory facilities and related infrastructure), the project is being constructed in two phases. Phase I began in August 2025 and officially commenced production in June 2026, while Phase II is currently under construction. Upon full completion, the project is expected to achieve an annual production capacity of 700,000 square meters of high-layer circuit boards, targeting the mid- to high-end PCB market. The project will further expand the group’s mid- to high-end PCB production capacity, enhance its overall industrial布局, strengthen its core competitiveness in AI computing, and support the high-end and intelligent transformation of regional manufacturing industries.

[Source: FPC News]

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