PCB and IC Substrate Capital Expenditure Race Heats Up; Equipment Makers Enter Traditional Peak Season

Source：TPCA　Updated Time：2026/07/01

The rapid growth of global AI opportunities is driving investment demand for high-end PCB HDI, IC substrate, and copper clad laminate (CCL) equipment. As equipment installation ramps up in the second half of the year, key PCB and IC substrate equipment suppliers — including Xunde, C Sun, Group Up, Hsum Feng, and leading AOI manufacturers such as Machvision, Utechzone, TRI, Unic Technology, as well as CCL equipment supplier Asia Metal — are expected to enter their traditional peak season in terms of operating performance.

Statistics show that, in response to AI-driven demand for HLC and ABF substrates, many rigid PCB manufacturers are expected to significantly increase capital expenditures this year compared with last year. Capital spending by Tripod Technology and Compeq is expected to exceed NT$10 billion, while Gold Circuit Electronics’ planned investments may surpass NT$17 billion. Zhen Ding Technology has also recently revised upward its annual capital expenditure guidance to start from NT$80 billion.

Leading substrate manufacturer Unimicron approved a board resolution on February 24 to raise this year’s capital budget from approximately NT$25.4 billion to around NT$34 billion. The company also approved approximately NT$2.5 billion in long lead-time equipment procurement orders for machinery scheduled to be installed in 2027, with an additional increase of approximately NT$6.7 billion, bringing the total to roughly NT$9.2 billion.

Kinsus recently secured shareholder approval for private placement proposals and reiterated its goal of achieving quarter-by-quarter growth this year. Previously, the company’s board had already approved NT$23.5 billion in capital expenditures to support ABF substrate capacity expansion over the next three years. For 2026, planned investment is approximately NT$8 billion, including NT$6 billion dedicated to ABF substrate expansion.

Following Nan Ya PCB’s (8046) recent shareholders’ meeting, General Manager Lu Lien-jui stated in an interview that, in anticipation of demand over the next 10 to 20 years, this year’s investment scale is expected to be the largest in the company’s history. Expansion plans are expected to continue for an extended period, with specific figures to be announced after board approval.

Driven by aggressive investments from these major manufacturers, equipment suppliers are also broadly optimistic about growth momentum during the peak season in the second half of the year. During a recent media gathering, Zhou Zhengjun, Chairman and CEO of high-end ABF substrate wet-process equipment supplier Hsum Feng, expressed confidence that AI and high-performance computing opportunities will continue driving substrate customers to actively expand production capacity, thereby boosting demand for the company’s advanced substrate manufacturing equipment. The company aims to maintain double-digit growth, with order visibility extending through 2027, while some customers have already begun discussions regarding 2028 demand. The company is also actively expanding into overseas markets.

(Source: Economic Daily News)

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