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TSMC Partners with ASML on Next-Gen Process to Boost Efficiency, Cut Costs, and Keep Pace with Surging AI Demand
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TSMC Partners with ASML on Next-Gen Process to Boost Efficiency, Cut Costs, and Keep Pace with Surging AI Demand
Source:TPCA Updated Time:2026/09/09
ASML and TSMC announced on September 7 that they will jointly drive the industry's transition to 12-inch photomasks, aiming to maximize the value of the most advanced High Numerical Aperture Extreme Ultraviolet (High NA EUV) lithography technology. TSMC plans to establish a 12-inch photomask pilot line by 2031, with the lithography system fully ready by 2033.
Industry observers note that TSMC and ASML have long been strategic partners, and as semiconductor manufacturing moves into the angstrom era with ever-finer line widths, lithography technology will play an increasingly critical role. By deepening their collaboration, the two companies will help TSMC advance next-generation processes more smoothly, reinforcing its dominance in the global foundry industry. Analysts note that High NA EUV systems carry a hefty price tag of roughly $380–410 million each (about NT$12 billion) — double the cost of first-generation EUV tools and the most expensive semiconductor equipment in history, with operating costs far exceeding existing EUV systems. Mass production adoption is expected as early as 2030, paving the way for future angstrom-class nodes such as A10.
TSMC stated that it will begin incorporating High NA EUV lithography into mass production of advanced nodes starting in 2030. As process technology continues to advance — particularly as AI applications drive increasingly complex transistor architectures — the number of mask layers requiring High NA EUV exposure will rise accordingly. High NA EUV will shift from the current 6-inch photomask to a larger 12-inch format, changing the specifications of photomasks, a key component in semiconductor manufacturing, in ways that will boost production efficiency, lower costs, and help the industry keep pace with surging AI demand. TSMC Chairman C.C. Wei said TSMC firmly believes that only by joining forces across the industry to tackle complex challenges can companies unlock possibilities no single firm could achieve alone. He expressed hope that continued innovation will lower barriers and enable advanced solutions to be adopted at scale. ASML is the world's only maker of EUV lithography systems, making it an indispensable supplier of tools essential to producing the world's most advanced AI accelerators and other chips.
(News source: Economic Daily News)
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