PCB Leader Kinwa Electronics Invests NT$13.8 Billion to Expand into High-End PCB Market

TSMC Partners with ASML on Next-Gen Process to Boost Efficiency, Cut Costs, and Keep Pace with Surging AI Demand

ASE Rides the CPO Wave — Related Deployment to Enter Mass Production by Year-End

TSMC: AI Compute Demand to Surge 5x Annually — Company Targets Infrastructure Boom Through Advanced Logic, 3DFabric, and Beyond

Largan Invests NT$3.08 Billion in Taichung Land Purchase to Ramp Up New CPO Business

Intel Secures Major Advanced Packaging Deal: SK Hynix to Adopt EMIB Technology for Next-Gen HBM