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Processing Equipments for Assembly & SMT
- Components and Assemblies - Processing Equipments for Assembly & SMT
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- Acqueous Halogen Free Flux (2)
- Acqueous Halogenated Flux (4)
- Anisotropic Conductive Films (ACF) (4)
- Antioxydation Agents for Molten Solder (2)
- Assembled-Board Separation Machine (3)
- Bga Rework Station (4)
- Board Surface Cleaning Machine (1)
- Carrier Tape (1)
- Cleaning Agent (1)
- Cleaning Solvents/Solution (1)
- Clip Chip Equipment And Material (6)
- Cob Equipment And Material (4)
- CSP Equipment And Material (5)
- Deflux Equipment (6)
- Desk Top SMT Equipment (1)
- Dispenser (2)
- Display Module (1)
- General Purpose Pick And Place Machine (2)
- Hot Air Reflow (1)
- Laser Marking (3)
- Lead Free Reflow Process (Wave Soldering For Lead-Free) (1)
- Lead-Free Solder/Solder Pastes/Solder Ball (5)
- LSI Device (1)
- N2 Generator (2)
- N2 Reflow Equipment (1)
- Non Clean Flux/Flux (1)
- Reflow Oven / Versaflow (4)
- Router (3)
- SMD Attachment Machine (1)
- SMD Bandoleer Equipment (1)
- SMT Equipment Parts And Second Equipment (4)
- SMT Glue (6)
- Solder Paste Mixer (1)
- Solder Paste Printing Machine (6)
- Stencil Cleaning Equipment (4)
- Thermometer/ Sensor Shuttle (3)
- Touch Up Equipment (1)
- Ultra High Speed Pick And Place Machine (1)
- Miscellaneous Materials for Printed Circuit Assembly (4)
- BGA/CSP Assembly System (2)
- Bulk Feeder (2)
Total 108 Processing Equipments for Assembly & SMT Related Products
JTR Lead-Free Nitrogen/Hot Air Reflow Oven
Model:JTR Lead-Free Nitrogen/Hot Air Reflow Oven
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / Reflow Oven / Versaflow
Specs: 1. Reinforced main hanging bracket to guarantee that there is no deforming and board jamming occured. 2. Multi-layer thermal insulation design. The Surface temperature of the Oven body is reduced by 10 to 20 degrees, reducing the temperature of the working environment effectively. 3. New cooling co
Supplier: TAIWAN KONG KING CO., LTD. (TKK)
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2 Processing Equipments for Assembly & SMT Related Products
Model:
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / Laser Marking
Specs:
Supplier: HON LONG INTERNATIONAL CO., LTD.
Inquire 1 Processing Equipments for Assembly & SMT Related Products
In-Line Laser Marking System
Model:ALU-900
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / Laser Marking
Specs: *In-Line design
Supplier: ABLETEK INC.
Inquire 1 Processing Equipments for Assembly & SMT Related ProductsModel:
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / General Purpose Pick And Place Machine
Specs:
Supplier: TOYOBISHI CORPORATION
Inquire 1 Processing Equipments for Assembly & SMT Related ProductsModel:
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / Reflow Oven / Versaflow
Specs:
Supplier: ISMART TECHNOLOGY CO., LTD.
Inquire 1 Processing Equipments for Assembly & SMT Related Products
Anti static adhesive dust roller, dust removal roller
Model:Adhesive thickness (mm) 0.3mm-10mm according to cu
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / Anisotropic Conductive Films (ACF)
Specs: Anti static adhesive dust roller is suitable for circuit boards, PCB，LCD， Surface cleaning treatment for light guide plates, electronic semiconductors, and flexible film printing, cleaning glass panels, laminated steel plates, workbenches, and other flat surfaces. It is used in conjunction with adhe
Supplier: Shenzhen Weierjia Technology Co., Ltd
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NuProgPlus-U16 Universal Gang Programmer and Duplicator
Model:NuProgPlus-U16
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / Desk Top SMT Equipment
Specs: The NuProgPlus Series is a powerful universal programmer that supports a wide range of devices, including EEPROM, Flash, MCU, eMMC, and UFS, with the added capability of duplicating eMMC and UFS devices. With a newly designed FPGA kernel architecture, NuProgPlus-U16 offers up to 16 socket sites, ena
Supplier: DediProg Technology Co., Ltd.
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flip chip die bonding machine
Model:FLWD
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / Clip Chip Equipment And Material
Specs: Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles to pick-and-place flipped chips onto substrates, then connecting the chip electrodes through
Supplier: jiangsu himalaya semiconductor co., ltd.
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Surface Mount Cleaning Machine (In-Line Type)
Model:YC-300SD-SMT
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / Board Surface Cleaning Machine
Specs: ● To clean PCB by direct contact with cleaning rollers, then removing the foreign bodies from cleaning rollers to adhesive rolls thru contact. ● The anti-static devices at inlet & outlet can reduce PCB’s static to achieve better cleaning effect. ● The unique formulated material of
Supplier: YEE CHANG PRECISION MACHINERY CO., LTD.
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Conformal Coating System
Model:iL500
Category: Components and Assemblies / Processing Equipments for Assembly & SMT / Dispenser
Specs:
Supplier: EVERPRECISION TECH CO.,LTD.
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