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Total 128 Electronics Packaging and Equipment Related Products
Akrometrix TherMoire AXP 2.0 Flatness Measurement and Analysis Systems
Model: Akrometrix TherMoire AXP 2.0
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / IC Packaging
Spec: The TherMoire AXP is a modular metrology solution that utilizes the shadow moire measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoire AXP captures a comple
Supplier: Teltec Pacific Ltd
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3 Electronics Packaging and Equipment Related Products
Relay Module
Model: G6D-OC_YA Series
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / Miscellaneous Electronics Manufacturing Service
Spec: 1a contact form barrier type terminal block LED motion &power indicator
Supplier: Bore Automation Tech. Co.,ltd.
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Akrometrix DIC & CRE Module & Interface Analysis software
Model: Akrometrix DIC & CRE & Interface Analysis software
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / IC Packaging
Spec: DIC Module Digital Image Correlation is a non-contact, full-field optical technique for measuring both in-plane and out-of-plane displacements of an object surface. A high contrast, random speckle pattern is applied to the surface of interest. Two cameras are mounted above the oven, viewing the samp
Supplier: TELTEC SEMICONDUCOTR PACIFIC (TAIWAN) LTD.
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SIL2
Model: SIL2
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / Miscellaneous Electronics Manufacturing Service
Spec: SIL2
Supplier: Norres Taiwan Co., Ltd.
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wafer dicing saw
Model: WDS-01
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / Multiple Assembled Panel Deviding
Spec: Product Advantages High Efficiency: Full automation reduces manual intervention. High Precision: Advanced motion control ensures machining accuracy. Intelligent Operation: Multiple detection functions guarantee processing quality. Wide Compatibility: Supports various materials and process require
Supplier: jiangsu himalaya semiconductor co., ltd.
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TB62209FG Stepping Motor Driver Chip
Model: TB62209FG
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / IC Packaging
Spec: TB62209FG is a high-performance stepping motor driver chip designed by Toshiba. It's specifically tailored for industrial, office automation, and consumer electronics applications. Key features of the TB62209FG include optimized circuit design for low interference, power supply stability through rip
Supplier: Avaq Semiconductor Co., Limited
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DS1213C RTC Chip
Model: DS1213C
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / Chip & Component Assembly
Spec: The DS1213C is a real-time clock (RTC) chip from Maxim Integrated, designed for accurate timekeeping and timestamping in various electronic devices. This chip offers a wide operating voltage range and low power consumption, making it suitable for battery-powered applications. With built-in oscillato
Supplier: Lisleapex Electronic
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Cylindrical Aluminum Can DC Link Capacitor DMJ-MC
Model: DMJ-MC
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / Through-Hole Component
Spec: Application 1. Inverters of Wind Power and Solar Power. 2. Frequency Converter. 3. UPS/SVG/APF. Basic Parameters Capacitance range 50μF~4000μF Rated voltage 450V.DC~4000V.DC Cap.tol ±5%（J）；±10%（K）
Supplier: CRE
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Tragbare Signalstorsender J10P in Silber
Model: J10P
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / Miscellaneous Electronics Manufacturing Service
Spec: Kernvorteile ‧ Vollstandige Abdeckung: Storen Sie prazise GSM/3G/4G/5G-Mobilfunknetze, blockieren Sie gleichzeitig GPSL1/WiFi 2,4 und 5,8 GHz/Lojack und 315–868 MHz Fernbedienungsfrequenzbander und erreichen Sie eine vollstandige Kommunikationsisolierung ‧ Warmeableitung in Militarqualitat: drei Luf
Supplier: Signal Jammer Phone
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Spatec equipment parts
Model: VACUUM PUMP / VACUUM PAD / ACTUATOR VALVE
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / Miscellaneous Electronics Manufacturing Service
Spec: SPATEC's vacuum parts are widely used by major equipment manufacturers in Korea because of their stable quality, complete items and specifications.
Supplier: RAINBOW MST INC.
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