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MEI HO ENTERPRISE CO., LTD.

Mei-Ho Meihe Enterprise Co., Ltd. established the PCB Abrasive Materials Division in 2008, and cooperated with Nikken Japan Paper Research Co., Ltd. to develop HDI / IC /FC high-order carrier materials. In 2012, we added a subsidiary in Dongguan, Dongguan City. Research Optoelectronics Co., Ltd., FPC Soft Board Division, Wafer Semiconductor Division, Mei-Ho have now spanned a number of industries, including the development and sales of precision grinding machine tools, electronics, wafer grindin...More