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• Super Thin Copper Foil for IC substrate has launched !

 

Super Thin Copper Foil for IC substrate has launched !

 

Date Published: 2023/11/10

 

Topnano launches new product: Super Thin Copper Foil for IC substrate .
This product is made of 18um copper carrier foil and 3um ultra-thin peelable copper foil.

It is suitable for mSAP semi-additive process in PCB manufacturing, recommended line width/space (L/S) ≒40/40 for fine line substrate application.

 

Link: https://topnano.com.tw/products.php?id=65