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- Electrolytic Plating Equipment (6)
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Tel:886-3-4606151
Fax: 886-3-4606150
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- STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
Model: SVCP
Category: Machines & Equipments for PCB / PCB Wet Process Equipment / Electrolytic Plating Equipment
Characteristics
● Modular design fulfill customers’ requirement
● Apply to panel plating
● Fully auto. loading/unloading ,save manpower
● No auxiliary frame and jig to be used for board thickness 0.134 to 2.0 mm during production
● Uniform distribution of plating quality
● Remarkable throwing power of high aspect ratio for through hole, blind via , via fill and TH fill plating
● Auto online chemical stripping
● Easy operation and maintenance
Specs
● Panel size : A. 24”Dx 24”W (Max.) , 16”D x 14”W (Min.)
B. 32”D x 24”W (Max.) , 24”D x 14”W (Min.)..Option
● Board thickness : 0.1 mm + Copper foil H/H ~ 2.0 mm
● Line speed : 0.3 ~ 1.5m/min ( Adjustable )
● Plating window : 610D (810D) x 5280L (mm)/Chamber
● Plating cell : 1~6 Chamber (Option)
● Current density : 30 ASF (Max.) for Soluble anode
40 ASF (Max.) for Insoluble anode
● Anode : Soluble copper ball for basket type or Insoluble anode
(Ti mesh with IrO2 coating)
● Cathode : Vertical clamping system
● Application:
Featured Products
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Vertical Continuous Copper Plating Equipment
-
VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
-
STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)
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DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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REEL TO REEL VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT