Featured Products
- Laser Driller (6)
- Routing Machine (6)
- Laser Direct Imaging (5)
- Circuit Board Processing (3)
- Pick & Place Equipment (1)
- Others (1)
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- Optical Apparatus (Projectors, Magnifiers etc) (1)
- Lamination (1)
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Related Products
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Stencil Laser Equipment
Model: LPKF Stencil Laser P6060
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Stencil Laser Equipment
Model: LPKF PowerCut 6080
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Stencil Laser Equipment
Model: LPKF MicroCut 6080
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LPKF StencilLaser
Model: LPKF StencilLaser G6080
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LPKF ML UV Laser Cutting
Model: ML UV 2000 Si
Contact Information
Tel: +886-3-2223170
Fax: +886-3-2223150
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- Featured Products
- LPKF Through-Glass Vias with Laser Precisions
LPKF Through-Glass Vias with Laser Precisions
Model: LPKF Vitrion 5000
Category: Machines & Equipments for PCB / PCB Wet Process Equipment / Routing Machine
Characteristics
‧ Glass as interposer
‧ Efficient ultrafast laser process
‧ Up to 5 000 holes per second
‧ Standard production wafers
Featured Products
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Microqubic 2D/3D Microscopes and Modular Imaging Systems
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SW for Laser Machines
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Precision laser micromachining systems
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Contactless Endeffector for wafer/Solar Cell
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Wafer Mounter, UV Curing System, and Expansion Tool
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SSAIL (Selective Surface Activation Induced by Laser)
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Maskless lithography systems
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8 inch Maskless Lithography System
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Ultra-compact CtS System with UV laser diodes
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Femtosecond Laser Hybrid Micro-fabrication System
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multi-functional printing and coating system
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Laser Microjet System
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Stencil Laser Equipment
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Automated Laser Depaneling of Rigid and Flexible PCBs
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LPKF 3D-MID LDS
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Micromaterial processing with Laser Technology
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Stencil Laser Equipment
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UV Laser system for Flex Drilling and Cutting
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LPKF Through-Glass Vias with Laser Precisions
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LPKF ML UV Laser Cutting