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- UV Laser system for Flex Drilling and Cutting
UV Laser system for Flex Drilling and Cutting
Model: LPKF ML 5000
Category: Machines & Equipments for PCB / PCB Dry Process Equipment / Others
Characteristics
The MicroLine 5000 is a laser drilling and cutting system specifically tailored to the needs of the flexible circuit industry. With the ability to drill holes down to 20 μm, a variety of both organic and inorganic substrates can be processed such as:
Flexible PCBs
IC substrates
High Density Interconnect PCBs
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Microqubic 2D/3D Microscopes and Modular Imaging Systems
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SW for Laser Machines
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Precision laser micromachining systems
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Contactless Endeffector for wafer/Solar Cell
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Wafer Mounter, UV Curing System, and Expansion Tool
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SSAIL (Selective Surface Activation Induced by Laser)
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Maskless lithography systems
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8 inch Maskless Lithography System
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Ultra-compact CtS System with UV laser diodes
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Femtosecond Laser Hybrid Micro-fabrication System
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multi-functional printing and coating system
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Laser Microjet System
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Stencil Laser Equipment
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Automated Laser Depaneling of Rigid and Flexible PCBs
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LPKF 3D-MID LDS
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Micromaterial processing with Laser Technology
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Stencil Laser Equipment
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UV Laser system for Flex Drilling and Cutting
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LPKF Through-Glass Vias with Laser Precisions
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LPKF ML UV Laser Cutting