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VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
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Contact Information
Tel:886-3-4606151
Fax: 886-3-4606150
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Vertical Continuous Copper Plating Equipment
Model: VCP
Category: Machines & Equipments for PCB / PCB Wet Process Equipment / Electrolytic Plating Equipment
Characteristics
*Apply to panel and pattern plating process
*Fully auto. loading/unloading, save manpower
*No auxiliary frame and jig to be used for board thickness 0.06 to 3.2 mm during production
*Uniform distribution of plating quality
*Remarkable throwing power of high aspect ratio for through hole, blind via and via fill plating
*Modular design can fulfill customers’ requirement
*Auto. online chemical stripping
*Easy operation and maintenance
Specs
Panel size: 24” x 24” (Max.); 16” x 14” (Min.) Standard
32” x 24” (Max.); 24”x 14”(Min.) Option
Board thickness : 0.06 ~ 1.6 mm for DC Rectifier
0.06 ~ 3.2 mm for PPR Rectifier
Speed of line: 0.3 ~ 1.5 m/min (adjustable)
Plating window: 610(810) x 4800 mm/Chamber
Current density: 40 ASF (Max.) for DC Rectifier
80 ASF (Max.) for PPR Rectifier
Anode: Insoluble anode (Ti mesh with IrO2 coating )
Cathode: Vertical clamping system
Featured Products
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Vertical Continuous Copper Plating Equipment
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VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
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STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)
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DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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REEL TO REEL VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT