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- Electrolytic Plating Equipment (6)
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Contact Information
Tel:886-3-4606151
Fax: 886-3-4606150
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- VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
Model: VCP(DT)
Category: Machines & Equipments for PCB / PCB Wet Process Equipment / Electrolytic Plating Equipment
Characteristics
*Apply to panel and pattern plating process
*Double track design increase double capacity but occupy less space
*Use six axis robot with CCD to detect edge of panel accurately
*Unloading M/C to unload panel automatically to save manpower
*No auxiliary frame and jig to be used for board thickness 0.06~ 1.6 mm during production
*Uniform distribution of plating quality
*Remarkable throwing power of high aspect ratio for through hole, blind via , via filling and through hole filling process
*Modular design can fulfill customers’ requirements
*Auto. chemical online copper stripping
*Easy operation and maintenance
Specs
*Panel size: 24” x 24” (Max.) ; 16” x 14” (Min.)
*Board thickness: 0.06 ~ 1.6 mm
*Speed of line: 0.3 ~ 1.2 m/min (adjustable)
*Plating window: 610 x 4800 mm/Chamber x 2 tracks
*Current density: 40 ASF (Max.)
*Rectifier: DC Switching
*Anode: Insoluble anode (Ti mesh with IrO2 coating )
*Cathode: Double Tracks vertical clamping system
Featured Products
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Vertical Continuous Copper Plating Equipment
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VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
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STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)
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DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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REEL TO REEL VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT