Featured Products

 

• Electrolytic Plating Equipment (6)
• (1)

 

Related Products

 

• 

  Vertical Continuous Copper Plating Equipment

  Model: VCP

• 

  VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)

  Model: VCP(DT)

• 

  STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT

  Model: SVCP

• 

  U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT

  Model: UVCP

• 

  DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT

  Model: DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQ

 

Contact Information

 

Inquire Now

 

Tel:886-3-4606151

Fax: 886-3-4606150

More Info

 

• Home
• Featured Products
• U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)

 

U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)

 

Model: UVCP(DT)

Category: Machines & Equipments for PCB / PCB Wet Process Equipment / Electrolytic Plating Equipment

 

Inquire Now

 

 

Characteristics

 

*Specially for SAP and MSAP process of IC substrate i.e. Flip Chip BGA, CSP, Flip Chip, CSP
*Use one size frame to assist production to ensure smooth transportation without touching *panels and better quality for pattern.
*Use six axis robot with CCD to detect edges of panels accurately
*Unloading M/C to unload panel automatically to save manpower
*For extra fine pattern: LW/LS:12/9 μm
*Uniform distribution of plating quality
*Remarkable throwing power for extra fine pattern on thin board, blind via filling and *through hole filling.
*Modular design can fulfill customers’ requirements.
*Auto. online chemical stripping.
*Easy operation and maintenance

 

Featured Products

 

• #