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Contact Information
Tel:886-3-4606151
Fax: 886-3-4606150
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- DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
Model: DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQ
Category: Machines & Equipments for PCB / PCB Wet Process Equipment / Electrolytic Plating Equipment
Characteristics
ts design is to replace conventional lines and solve problems of panel fall and chemical contamination, design of dual tracks can increase capacity; competitive price will be low down production cost, it’s easy for operation and maintenance, matching with PC automatic system applying to Cu plating on PCB and good performance for throwing power of BVH and PTH, etc.
Specs
Panel size : A. 24”x 24” (max.); 18” x 16” (min.) (Standard)
B. 28”x 24” (max.); 22” x 16” (min.) (Option)
C. 32” x 24” (max.); 26” x 16” (min.) (Option)
Board thickness : 0.1 mm + Copper foil H/H ~ 2.0 mm
Line speed : 0.2 ~ 0.8 m/min (Adjustable)
Plating window : 610 (710) (810) x 5280 (mm)/Chamber x 4 x 2 tracks = 21.12 m x 2 tracks
Current Density: 30 ASF (max.)
Anode : Soluble copper ball for basket type or Insoluble anode (Ti mesh with IrO2 coating)
Cathode : Single flight bar dual track clamping system
Throughput : 260,000ft2/month (size 24” x 18 ”)
300,000 ft2/month (size 28” x 24 ”)
350,000 ft2/month (size 32” x 24 ”)
Base on 30 ASF; Plating thickness 25μm
Working hour 24 hrs x 27 days=648 hrs/month
Featured Products
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Vertical Continuous Copper Plating Equipment
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VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
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STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)
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DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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REEL TO REEL VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT