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UltraT Manual Wafer, PhotoMASK, & Substrate Cleaning Systems
Model: UltraT Model SCSe124
Category: Machines & Equipments for PCB / PCB Wet Process Equipment /
Characteristics
The highly efficient Model SCSe124 is the ideal solution for submicron cleaning of Photomasks, Wafers and Substrates. The very reliable and cost effective system utilizes proven assortment of cleaning technologies. The SCSe124 can be configured with several different cleaning options form High Pressure DI, Atomizing Mist Nozzle, Brushes, Megasonic Pies and Nozzles, and much more. The Rapid and Effective Drying technique combines Variable Spin Speeds optional Heated DI, Nitrogen Assist or Heat Lamp. The SCSe124 has a Microprocessor Controller allowing variable process parameters and retention of up to (10) ten process programs in memory.
Specs
FEATURES:
Up to Ten (10) Inch Diameter Substrate Compatibility
Main Spindle Assembly having DC Brushless Motor (can be upgraded for more control).
Adjustable Arm Speed and Travel Positions.
Radially Exhausted Chamber for Maximum Laminar Flow.
Stand-alone Polypropylene Cabinet.
Microprocessor Control Capable of Retaining Ten (10) Programs in Memory
Built in Safety Interlocks.
Push Button Lid Open/Close.
Touch Screen Graphic User Interface (GUI) with Ease of Programming & Security Lockouts and On-Screen Error Reporting.
Maximum Capability of Two Arms.
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