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- Electroless Copper Plating Solution (4)
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Supper Thin Surface Copper Via-filling -VFP28
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Contact Information
Tel:86-020-84382888
Fax: 86-020-84380294
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- Quick/Large Blind-via Filling -VFP08
Quick/Large Blind-via Filling -VFP08
Model: Quick/Large Blind-via Filling -VFP08
Category: Materials and Chemicals for PCB / Chemicals for PCB / Electroless Copper Plating Solution
Characteristics
●Excellent filling performance maintained at high filling rate
●Outstanding via filling performances,Dimple?10μm
●Lower surface copper thickness<15μm (4/3 mils standard via hole)
●Stable via filling performance,high reliablity plating coating
●Compatible with both soluble and insoluble anode plating equipment
Featured Products