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- Supper Thin Surface Copper Via-filling -VFP28
Supper Thin Surface Copper Via-filling -VFP28
Model: Supper Thin Surface Copper Via-filling -VFP28
Category: Materials and Chemicals for PCB / Chemicals for PCB / Electroless Copper Plating Solution
Characteristics
●Fill microvia after PTH & flash plating, surface film thickness<8μm (4mil aperture / 3mil dielectric thickness);
●Good copper uniformity, suitable for fine lines;
●Applied to normal plating equipment of insoluble anode;
●All additives can be analysed by CVS and are easy to control.
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