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Contact Information
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- MSAP Pattern Via-filling –TFP
MSAP Pattern Via-filling –TFP
Model: MSAP Pattern Via-filling –TFP
Category: Materials and Chemicals for PCB / Chemicals for PCB / Electroless Copper Plating Solution
Characteristics
●Applied to the MSAP process with good via-filling performance;
●Line arc rate ? 20%;
●Copper plating uniformity ± 3μm;
●Applied to plating equipment of insoluble anode;
●All additives can be analysed by CVS and are easy to control.
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