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- Multilayer Inductive Bonding
Multilayer Inductive Bonding
Model: Bonding 168, Bonding 200, Bonding 211
Category: Printed Circuit Board / Printed Circuit Board / Rigid Board
Characteristics
By inductive-magnetic heating system, there's no limit on layer-count. The most advanced 8G induction bonding system is faster in heating rate 50% more than previous generation with a low-power consumption.
Featured Products
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X-RAY Inspection Equipment
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Multilayer Inductive Bonding
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Clean Oven-WOL
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Roller Coater Line with Oven System
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RTR VACUUM LAMINATOR
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Automated Optical Inspection System
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JTR Lead-Free Nitrogen/Hot Air Reflow Oven
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X-ray System
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RTR Exposure machine
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Testing System
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Testing System
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RTR AOI/AVI Automatic Inspection Machine
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Flying Probe Tester
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AOI/AVI
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Super Belt Sander/Deburer
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Contract Service for OS Testing/ Film / Solder Mask
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Printer
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Surface Mount Placement