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- Copper foil substrate (1)
- ITO film (1)
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Tel:886-02-2298-3539
Fax: 886-02-2299-1200
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- R2R Sputtering OEM Service
R2R Sputtering OEM Service
Model: R2R Sputtering OEM Service
Category: Materials and Chemicals for PCB / Materials and Chemicals for FPC / Others
Characteristics
Top Nanometal Corp.’s roll-to-roll vacuum sputtering process and chemical process can produce a series of metal-clad thin films, graphite- clad cathode foils and transparent conductive films.
Taking copper-clad film as an example, copper ions are dissociated from targets and uniformly deposited on plastic substrates (e.g. PI, PET) to form a layer of dense metal-clad film. Copper-clad films by vacuum sputtering process have merits such as good uniformity of metal layer, productive, good adhesion, and high hardness.
Two-layer non-adhesive ultra-thin flexible copper clad laminate (sputtering FCCL, copper layer thickness ranges from 2um to 8um) produced by vacuum sputtering and chemical processes is an important FCCL substrate for fine pitch FPC design of 5G era.
We can provide various metal sputtering OEM services by customer needs, such as sputtering graphite on aluminum, and sputtering copper on PI and PET.
Top Nanometal Corp.’s regular used metal targets include: Cu, NiCr, NiCu, NiCuTi, C, Si, ITO targets. For you have other metal sputtering needs, such as Al, Ag, welcome to contact us for discussion. For new project purpose, we can purchase metal targets by needs.
Product application of Roll-to-roll vacuum sputtering process includes: EMI protection films, transparent conductive films, Thermal Heat Spreader, etc.
Featured Products