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• Micromaterial processing with Laser Technology

 

Micromaterial processing with Laser Technology

 

Model: LPKF ProtoLaser S4

Category: Printed Circuit Board / Printed Circuit Board / Circuit Board Processing

 

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Characteristics

 

The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional.

Cost-Effectiveness Built In
The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and accurately generate fine structures and uses a special procedure for ablating large areas. The laser process requires no masks or tools to produce one-offs or individual marks.

Expanded Process Window
Switching to a green laser wavelength increases the range of applications. A green laser is much less likely to burn the substrate. It can also reliably machine inhomogeneous metal layers up to 6 μm in thickness – e. g., boards with fully metallized surfaces following galvanic via plating. The ProtoLaser S4 can cut rigid or flexible substrates efficiently with thicknesses of up to 0.8 mm.

 

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