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• Automated Laser Depaneling of Rigid and Flexible PCBs

 

Automated Laser Depaneling of Rigid and Flexible PCBs

 

Model: LPKF PicoLine 3000

Category: Machines & Equipments for PCB / PCB Dry Process Equipment / Laser Driller

 

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Characteristics

 

LPKF PicroLine 3000 Ci Specification

Laser Class, Power

Class 1, Power up to 48W

Working area(X x Y x Z)

300 mm x 250 mm x 11 mm

Height of assembly(top/bottom)

27 mm/7 mm (1.1”/0.3”)

Positioning accuracy

± 25 μm (1 Mil) @ 22 °C ± 2 °C

Diameter of focused laser beam

25 μm (1 Mil)

Wavelength

532nm

System Dimensions (W x H x D)

875 mm x 1530 mm x 2000 mm

Weight(kg)

~1000 kgs

Facility requirements

400 VAC, 50-60 Hz, 16 A, 6.5 kVA, 0.6MPa(87 PSI), 130 l/min

Required accessories

Exhaust unit, external conveyor, production fixture, SMEMA interface

 

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