Featured Products

 

• Routing Machine (6)
• Laser Direct Imaging (5)
• Laser Driller (4)
• Circuit Board Processing (3)
• (2)
• Eyelets (1)
• Others (1)

 

Related Products

 

• 

  Femtosecond Laser Hybrid Micro-fabrication System

  Model: Laser Nanofactory

• 

  SSAIL (Selective Surface Activation Induced by Laser)

  Model: AKO 600

• 

  SinglePico Technology in Laser Processing

  Model: LPKF PicoLine 5000

 

Contact Information

 

Inquire Now

 

Tel:886-3-2223170

Fax: 886-3-2223150

More Info

 

• Home
• Featured Products
• Automated Laser Depaneling of Rigid and Flexible PCBs

 

Automated Laser Depaneling of Rigid and Flexible PCBs

 

Model: LPKF PicoLine 3000

Category: Machines & Equipments for PCB / PCB Dry Process Equipment / Laser Driller

 

Inquire Now

 

 

Characteristics

 

LPKF PicroLine 3000 Ci Specification

Laser Class, Power

Class 1, Power up to 48W

Working area(X x Y x Z)

300 mm x 250 mm x 11 mm

Height of assembly(top/bottom)

27 mm/7 mm (1.1”/0.3”)

Positioning accuracy

± 25 μm (1 Mil) @ 22 °C ± 2 °C

Diameter of focused laser beam

25 μm (1 Mil)

Wavelength

532nm

System Dimensions (W x H x D)

875 mm x 1530 mm x 2000 mm

Weight(kg)

~1000 kgs

Facility requirements

400 VAC, 50-60 Hz, 16 A, 6.5 kVA, 0.6MPa(87 PSI), 130 l/min

Required accessories

Exhaust unit, external conveyor, production fixture, SMEMA interface

 

Featured Products

 

• #
• #
• #
• #