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- Polyimide Film Sputter Copper
Polyimide Film Sputter Copper
Model: Polyimide Film Sputter Copper
Category: Materials and Chemicals for PCB / Materials and Chemicals for FPC / Copper foil substrate
Characteristics
*Using Roll to Roll(R2R) vacuum sputtering and chemical electroforming(electroplating) processes
*Copper thickness is between 2um and 8um, suitable for fine pitch (Pitch<30um) layout design.
*We have optical grade Polyimide Film,if customer want to use their own PI materials, he can email to discuss.
*Product features include: high heat resistance, fine flexural/bending endurance, good peel strength, copper layer uniformity, and dimensional stability.
*Application (Final products):FPC (Flex pcb),EMI Shielding Film,Conductive materials,Electronic materials for heat resistance...
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