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- Copper foil graphite heat dissipation material
Copper foil graphite heat dissipation material
Model: Copper foil graphite heat dissipation material
Category: Materials and Chemicals for PCB / Materials for PCB / Other Types of Metal Foil
Characteristics
-It is a composite material with both heat dissipation and temperature uniformity effects.
-Ultra-thin (<0.1mm) and light weight, suitable for non-ventilated environments.
-A variety of thickness specifications are available, the thickest 140um graphite copper foil is optional,which with better heat conduction effect
-The copper foil is sputtered with a layer of nano-scale graphite by the roll-to-roll sputtering process, without colloidal interference in the middle, and the heat dissipation effect is better.
-Compared with common artificial graphite sheets, it has good flexibility, is resistant to bending and is not brittle, and can conduct heat transfer.
-It has good flexibility and is resistant to bending, suitable for various die-cutting and molding processes, and can reduce the man-hours of subsequent processes.
Product application: suitable for all kinds of electronic products that require flat temperature uniformity/heat dissipation, such as: smart phones, tablet computers, notebook computers, CPUs, backlight modules, power adapters, wearable electronic products, etc.
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