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SLOTOCOUP XF60
Model: SLOTOCOUP XF60
Category: Materials and Chemicals for PCB / Chemicals for PCB / Additives for Copper Plating Bath
Characteristics
Latest development in Via filling process. Target to fill blind vias in Flash mode with minimum copper thickness on panel model (<3 μm) for mSAP applications enabling fine L/S down to 20/20 μm.
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