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- SSAIL (Selective Surface Activation Induced by Laser)
SSAIL (Selective Surface Activation Induced by Laser)
Model: AKO 600
Category: Machines & Equipments for PCB / PCB Dry Process Equipment / Laser Driller
Characteristics
Laser micromachining workstation for increased throughput. The working area of 600x400x200 mm enables the machining of larger parts or large pallets of smaller ones. Increased size allows multiple laser sources and a wider selection of beam-shaping devices.
APPLICATIONS
AKO 600 is a versatile tool suitable for multiple applications.
SSAIL
Glass cutting
Glass marking
Drilling
Micro cutting
Laser process R&D
Specs
AKO 600 Specifications |
||
|
Standard configuration |
Options |
Laser source |
DPSS femtosecond laser |
Fiber femtosecond laser, fiber nanosecond laser, multiple wavelengths |
Average laser power |
40 W |
10 - 200 W |
Positioning system |
XYZ linear stages, 2D galvo scanner |
XYZ1Z2 AB stages 3D galvo scanner Synchronized stages + galvo scanner motion 5 axis galvo scanner for 0 taper cutting |
Travel range |
600x400x200 mm |
|
Machine vision |
Integrated machine vision with automatic pattern recognition |
3D surface profiler |
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