Featured Products
- Laser Driller (6)
- Routing Machine (6)
- Laser Direct Imaging (5)
- Circuit Board Processing (3)
- Pick & Place Equipment (1)
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- Optical Apparatus (Projectors, Magnifiers etc) (1)
- Lamination (1)
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Related Products
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Precision laser micromachining systems
Model: PSG DR20x0/30x0 series
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SSAIL (Selective Surface Activation Induced by Laser)
Model: Akoneer AKO300 / AKO600
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Femtosecond Laser Hybrid Micro-fabrication System
Model: Femtika Laser Nanofactory
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Automated Laser Depaneling of Rigid and Flexible PCBs
Model: LPKF PicoLine 3000
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SinglePico Technology in Laser Processing
Model: LPKF PicoLine 5000
Contact Information
Tel: +886-3-2223170
Fax: +886-3-2223150
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- Laser Microjet System
Laser Microjet System
Model: SYNOVA LDS 300M
Category: Machines & Equipments for PCB / PCB Dry Process Equipment / Laser Driller
Characteristics
◆Solutions for compound semiconductors, power devices, and wafer dicing
◆Utilizes water-conducting lasers to achieve smooth cutting edges
◆Water jets simultaneously dissipate heat without creating a heat-affected zone (HAZ)
◆Processes any shape without the limitations of traditional tooling for right-angle machining
◆Capable of machining challenging materials such as SiC, ceramics, and diamond
Featured Products
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Microqubic 2D/3D Microscopes and Modular Imaging Systems
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SW for Laser Machines
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Precision laser micromachining systems
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Contactless Endeffector for wafer/Solar Cell
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Wafer Mounter, UV Curing System, and Expansion Tool
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SSAIL (Selective Surface Activation Induced by Laser)
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Maskless lithography systems
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8 inch Maskless Lithography System
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Ultra-compact CtS System with UV laser diodes
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Femtosecond Laser Hybrid Micro-fabrication System
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multi-functional printing and coating system
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Laser Microjet System
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Stencil Laser Equipment
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Automated Laser Depaneling of Rigid and Flexible PCBs
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LPKF 3D-MID LDS
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Micromaterial processing with Laser Technology
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Stencil Laser Equipment
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UV Laser system for Flex Drilling and Cutting
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LPKF Through-Glass Vias with Laser Precisions
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LPKF ML UV Laser Cutting


