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• IC Heat Spreader ,Sputtered Strip-Type Heat Sink

 

IC Heat Spreader ,Sputtered Strip-Type Heat Sink

 

ISO

 

Model: HOS100CC4-SS05

Category: Materials and Chemicals for PCB / Materials for PCB /

 

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Characteristics

 

This product is a high-performance thermal solution designed for IC packaging, such as BGA and FCBGA. Using an eco-friendly roll-to-roll sputtering process, it applies nanoscale and micrometer scale metallic thin layers onto high-thermal-conductivity electronic-grade copper foil to form a high-efficiency strip-type heat spreader.

Built with electronic-grade copper foil and high-conductivity metal thin layers to enhance heat conduction and heat dissipation

Contains no RoHS-restricted hexavalent chromium (Cr??) — only natural metallic chromium (zero-valent chromium) is used, fully compliant with global environmental regulations

More uniform film thickness and more stable performance compared to traditional electroplated heat spreaders

No additional solder-mask / green-paint coating required, preventing heat dissipation loss and improving thermal efficiency by approximately 5–10%

Ideal for high-density IC packages (FCBGA, BGA) and applications requiring strong thermal reliability

 

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