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Akrometrix DIC & CRE Module & Interface Analysis software
Model: Akrometrix DIC & CRE & Interface Analysis software
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / IC Packaging
Specs: DIC Module Digital Image Correlation is a non-contact, full-field optical techni......
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Microtronic Solderability Tests
Model: Microtronic LTB210
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / IC Packaging
Specs: LTB210 - Automated & PC Controlled Solderability Tester Microtronic offers an e......
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Akrometrix Wafer/Panel Thermal Warpage Measurement Tool
Model: Akrometrix AKM600P
Category: Electronics Packaging and Equipment / Electronics Packaging and Equipment / IC Packaging
Specs: The AKM600P is a metrology solution that utilizes the shadow moire measurement t......