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Akrometrix DIC & CRE 模組 & Interface Analysis軟體
產品型號：Akrometrix DIC & CRE & Interface Analysis
產品特色
DIC Module
Digital Image Correlation is a non-contact, full-field optical technique for measuring both in-plane and out-of-plane displacements of an object surface. A high contrast, random speckle pattern is applied to the surface of interest. Two cameras are mounted above the oven, viewing the sample from different angles.
Two simultaneous images from both cameras are digitized. Software identifies the same point on the surface from both perspectives, using pattern recognition of the speckles within a small pixel window. Using the principle of stereo triangulation, the spatial position of the pixel window relative to the cameras is determined in 3D space. Stepping the pixel window across the sample, the warpage of the surface can be mapped out in 3 axes.
CRE Module
Scheduled for release in mid 2014, the CRE (Convection Reflow Emulation) Module is an add-on module for the TherMoire AXP and Studio PS400 systems powered by the Studio Software. The CRE Module addresses the semiconductor industry requirement for maximum resolution surface measurement and effective reflow emulation with optimized top/bottom temperature uniformity, while utilizing convection heating.
The CRE Module enhances Akrometrix's industry-standard shadow moire measurement technique and offers Z displacement measurement from 2.5 microns down to sub-micron resolution. The CRE Module is the fourth add-on module for the expandable TherMoire platform.
Akrometrix Interface Analysis軟體
實時監測迴流焊過程中PCB及元器件變形情況3D圖形分析軟體
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