Fastscan精確的力控制模式提高了圖像解析度的同時, 延長了探針的使用壽命。掃描速度20Hz時仍能獲得高品質的TappingModeTM圖像, 掃描速度6Hz仍能獲得高品質的ScanAsyst圖像。低噪音, 溫度補償傳感器展現出mA等級的數據。
Bruker TriboLab CMP
Small Scale CMP Polishing Process Control for R&D
The Bruker TriboLab CMP (Chemical Mechanical Processing) tribometer is specifically for cost-effective characterisation of wafer polishing processes in research and development
Reproduce full-scale wafer polishing-process conditions
Unmatched measurement repeatability and detail
Test small coupons instead of whole wafers, for significant cost savings
產品規格
Dimension FastScan™ AFM applies the performance of AFM application in polymer, semiconductor, energy, data storage and materials such as field nanoscale research. FastScan™ achieves atomic force microscopy imaging without compromising highest resolution, application flexibility, or productivity. The system delivers atomic resolution imaging while simultaneously providing real-time maps of properties derived from the individual force interactions. Whether you scan at >125Hz when surveying a sample to find the region of interest, or at time rates of 1-second per image frame in air of fluids, the Dimension FastScan redefines the AFM experience.
Dimension FastScan™ High scan rate or ultimate resolution while maintaining exceptional tip force control is a leap into a new generation of AFM use. The FastScan AFM system is the latest evolution of our industry-leading, tip-scanning AFM technology, incorporating temperature-compensating position sensors in its two scanners to render noise levels in the sub-angstrom range for the Z-axis, and angstroms in X-Y. In the air or in the liquid imaging speed is 100 times as much as the original speed, automatic laser alignment and detector adjustment, Intelligent needle inserting, shorten experiment time largely. This is extraordinary performance in a large-sample system, using 34- and 90-micron scanner ranges and surpassing the open-loop noise levels of high-resolution AFMs.
Dimension FastScan™ AFM has automatic imaging ability for big samples, making it widely used in the manufacturing process of the semiconductor and data storage equipments, it can measure diameter of 200 mm measured on more than 100 samples of the area. It has all the configuration of an atomic force microscope and the scanning tunneling microscope, can be used as surface roughness measurement defects detecting and other characteristics in the three dimensional and no damage to sample during the measurement process and don't need to sample pretreatment and modified.
Bruker TriboLab CMP
Small Scale CMP Polishing Process Control for R&D
The Bruker TriboLab CMP (Chemical Mechanical Processing) tribometer is specifically for cost-effective characterisation of wafer polishing processes in research and development
Reproduce full-scale wafer polishing-process conditions
Unmatched measurement repeatability and detail
Test small coupons instead of whole wafers, for significant cost savings
Reduce Costs with Small Scale Testing
CMP process development and research into new materials and consumables (eg pads, slurries, conditioning disks) on full-scale production systems is expensive. The costs can add up: test wafers, consumables, overheads, depreciation and lost productivity when running tests instead of production wafers. With the TriboLab CMP you can perform studies on coupons cut from larger wafers, resulting in substantial cost savings.