2/F., B Building, No.10, Lu-hsing Street, Lu-Chu Township, 338 Taoyuan County, Taiwan
MacDermid Enthone MultiBond MP is the leading technology for
innerlayer adhesion promotion designed specifically to perform at
the high temperatures required for today’s lead-free soldering of
circuit boards. An exceptional alternative to oxide whose chemistry is
compatible with all existing equipment, MultiBond MP is supported by
MacDermid Enthone’s renowned on-site service.