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Direct metallization, replacing electroless copper, has become
the default process for the newest PCB specifications. And carbon
technology wins; meeting the demands of reliable microvia
connections and resin compatibility. But carbon technology has
been tough on thin foil constructions due to the final copper
With Eclipse LE, the low-cost, process simplicity and environmental
benefits of carbon direct metallization meet the design challenges
of thin-foil, flex, and coreless constructions, while maintaining the
microvia connection reliability OEMs have come to love with carbon
Eclipse LE imparts a copper protection during the conditioning
step, allowing for a super-mild microclean after carbon deposition.
Carbon selectivity has never been better. And your profits will never
be better, building the most difficult PCBs, with the world’s most
efficient primary metallization chemistry.