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聯絡資訊
2/F., B Building, No.10, Lu-hsing Street, Lu-Chu Township, 338 Taoyuan County, Taiwan
電話:886-3-3120280
傳真:886-3-3120380
PackagePrep CE Tin S
產品型號:PackagePrep CE Tin S
產品分類:原物料、耗材與化學品 / 硬板用化學品 / 化學錫
產品特色
QFN’s have become the preferred high density leadframe-based
surface mount package. But the advantage of this versatile package
comes at a price. Exposed copper at the singulated edge of the
package solders poorly, preventing conventional solder fillets from
forming. The lack of a visible solder fillet inhibits recognition by
automated optical inspection (AOI). Furthermore, the smaller solder
footprint creates reliability risk, limiting the end-use applications that
designers will consider.
PackagePrep solves these problems. PackagePrep deposits an easily
soldered metal finish on the exposed copper edges. After paste
reflow, solder wicks up the side of the QFN flanks. The new QFN
fillets are easily inspected by existing top-down AOI as well as visual
inspection, supplementing x-ray inspection.
Planning to use QFN’s in your high reliability application, but
concerned about reliability and inspectability? Let PackagePrep be
your solution.
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