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- Electrolytic Plating Equipment (6)
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Tel:886-3-4606151
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- U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
Model: UVCP
Category: Machines & Equipments for PCB / PCB Wet Process Equipment / Electrolytic Plating Equipment
Characteristics
-Specially for SAP and MSAP process of IC substrate i.e. Flip Chip BGA, CSP, FC CSP, it can be collocated with resister plating process.
-One fixed size of frame to assist production and transportation without touching panels to get better plating quality of pattern.
-Use 6 axis robot with CCD to detect edges of panels accurately.
-Unloading M/C to unload panel automatically to save manpower.
-For extra fine pattern: LW/LS :12/ 9 μm
-Uniform distribution of plating quality.
-Remarkable throwing power for extra fine pattern on thin board, blind via filling and through hole filling.
-Modular design fulfill different requirement of production.
-Auto. online chemical stripping.
-Easy operation and maintenance.
Specs
- Panel size : Frame with one fixed size
- Board thickness : 0.046 ~ 0.4 mm
- Line speed : 0.2 ~ 0.8 m/min (adjustable)
- Plating window : 610 x 5280 mm/Chamber
- Current density : 30 ASF (Max.) for DC Rectifier
- Anode : Insoluble anode (Ti mesh with IrO2 coating)
- Cathode : Single track continuous transportation
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